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Modification of Surface Properties of Silicon Wafers by Laser-Assisted Electrochemical Etching

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In this paper, the structural properties of porous silicon layer PSL were reported. Photo-assisted (laser) electrochemical etching PECE technique used to fabrication PSL from n-type wafer silicon as a function of etching time. Optical microscopy OM image is confirmed that the surface topography of porous silicon layer formation was a mud-like structure. The porosity and thickness have been determined gravimetrically are varied from 61% to 82% and 7.2 µm to 9.4µm respectively. The XRD patterns show that one diffraction peak for all PSL through anodization duration and it is assigned to the (400) plane and data confirmed the porous silicon PS was nanocrystalline.


International Letters of Chemistry, Physics and Astronomy (Volume 80)
H. A. Hadi, "Modification of Surface Properties of Silicon Wafers by Laser-Assisted Electrochemical Etching", International Letters of Chemistry, Physics and Astronomy, Vol. 80, pp. 30-39, 2018
Online since:
December 2018

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