Paper Titles in Periodical
International Letters of Chemistry, Physics and Astronomy
Volume 55
Subscribe

Subscribe to our Newsletter and get informed about new publication regulary and special discounts for subscribers!

ILCPA > Volume 55 > Numerical Study of Thermal Stresses for the...
< Back to Volume

Numerical Study of Thermal Stresses for the Semiconductor CdZnTe in Vertical Bridgman

Download PDF

Abstract:

The aim of this work is to present a numerical simulation of thermal stress in directional solidification of CdZnTe in vertical Bridgman apparatus. Especial attention will be attributed to show the importance of cooling temperature and time’s growth affecting the thermal stress. Furthermore, we will focus on investigating the thermal stress’ components and their distribution in crystal, which gives a detailed about the stress distribution and consequently on the distribution of defects during solidification of CdZnTe.

Info:

Periodical:
International Letters of Chemistry, Physics and Astronomy (Volume 55)
Pages:
66-78
DOI:
10.18052/www.scipress.com/ILCPA.55.66
Citation:
H. Jamai et al., "Numerical Study of Thermal Stresses for the Semiconductor CdZnTe in Vertical Bridgman", International Letters of Chemistry, Physics and Astronomy, Vol. 55, pp. 66-78, 2015
Online since:
Jul 2015
Export:
Distribution: