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Hydrophilic Modified Clay Nanocomposites: Effect of Clay on Thermal and Vibrational Properties

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Abstract:

Epoxy (LY-556/HY-951) system filled with modified clay (MC) was synthesized by using mechanical shear mixing with the addition of hardener as tri-ethylene-tetra-amine (TETA). The effect of the fumed silica can be negated by the application of a shear force (e.g. mixing, brushing, spraying etc), allowing the liquid to flow, level out and permit the escape of entrapped air. The reinforcement effects of MC in the epoxy polymer on thermal, mechanical and vibration properties were studied. Curing study shows that the addition MC does not show any effect in the curing behavior of epoxy polymer. Thermogravimetry analysis (TGA) shows enhanced thermal stability for epoxy with MC fillers. The epoxy with MC fillers shows considerable improvement on tensile and impact properties over pure epoxy polymer. SEM studies shows that addition of clay significantly turns the epoxy system from brittle to ductile nature was played instrumental in scaling performance. The improvement in tensile and impact properties of nanocomposites is supported with the fracture surface studies. Epoxy with MC fillers shows enhanced vibration characteristics than that of the pure epoxy polymer. FTIR studies indicated the formation of C-H bonds on the surface of the nanocomposites.

Info:

Periodical:
International Letters of Chemistry, Physics and Astronomy (Volume 27)
Pages:
73-86
Citation:
A. Kishore et al., "Hydrophilic Modified Clay Nanocomposites: Effect of Clay on Thermal and Vibrational Properties", International Letters of Chemistry, Physics and Astronomy, Vol. 27, pp. 73-86, 2014
Online since:
February 2014
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Ng C. B., Schadler L. S., Siegel R. W., Nano Stuct Mater 12 (1999) 507-510.

Evora V. M. F., Shukla A., Mater Sci Eng A 361 (2003) 358-366.

Zhang M., Singh R. P., Mater Lett. 258 (2004) 408-412.

Wetzel B., Haupert F., Zhang M. Q., Compos Sci. Technol. 63 (2003) 2055-(2067).

Wetzel B., Rosso P., Haupert F., Friedrich K., Eng Fract Mech. 73 (2006) 2375-2398.

Adebahr T., Roscher C., Adam J., Eur Coatings J 4 (2001) 144-149.

Lin J. C., Chang L. C., Nien M. H., Ho H. L., Compos Struct. 74(1) (2006) 30-36.

Ragosta G., Abbate M., Musto P., Scarinzi G., Mascia L., Polymer 46 (2005) 10506-10516.

Zheng Y., Zheng Y., Ning R.,. Mater Lett. 57 (2003) 2940-2944.

Moloney A. C., Kausch H. H., Kaiser T., Beer H. R., J Mater Sci. 22 (1987) 381-393.

Bandyopadhyay S., Mater Sci Eng. A 125 (1990) 157-164.

Norman D. A., Robertson R. E., Polymer 44 (2003) 2351-2362.

Fiedler B., Gojny F. H., Wichmann M. H. G., Nolte M. C. M., Schulte K., Comp Sci Technol 66 (2006) 3115-3125.

Johnsen B. B., Kinloch A. J., Mohammed R. D., Taylor A. C., Sprenger S., Polymer 48 (2007) 530-541.

Wichmann M. H. G., Schulte K., Wagner H. D., Comp Sci Technol 68 (2008) 329-331.

Xie X. L., et al., Polym 45 (2004) 6665-6673.

Lazzeri A., Zebarjad S. M., Pracella M., Cavalier K., Rosa R., Polymer 46 (2005) 827-844.

Wichmann M. H. G., Cascione M., Fiedler B., Quaresimin M., Schulte K., Compos Interf 13 (2006) 699-715.

Iyagawa H., Jurek R. J., Mohanty A. K., Misra M., Drzal L. T., Compos A 37 (2006) 54-62.

Qi B., Zhang Q. X., Bannister M., Mai Y. W., Compos Struct 75 (2006)514-519.

Le Pluart L., Duchet J., Sautereau H., Polymer 46 (2005) 12267-12278.

Becker O., Varley R., Simon G., Polymer 43 (2002) 4365-4373.

Juwono A., Edward G., Int. J Nanosci. 4(4) (2005) 501-507.

Mohan T. P., Ramesh Kumar M., Velmurugan R., J Mater Sci 41 (2006) 5915-5925.

[ Pinnavaia T. J., Beall G. W., Polymer-clay nanocomposites. Wiley Series in Polymer Science, New York, 2000; 127-148.

Ashok Kumar M., Hemachandra Reddy K., Mohana Reddy Y. V., Intern J Polym Mater 59 (2010) 854-862.

Ashok Kumar M., Ramachandra Reddy G., Siva Bharathi Y., Venkata Naidu S., Naga Prasad Naidu V., J Comp Mater 46(26) (2010) 3195-3202.

Ashok Kumar M., Hemachandra Reddy K., Ramachandra Reddy G., Venkata Mohana Reddy Y., Subbarami Reddy N., Ind J Macromol 6(2) (2010) (in press).

Ashok Kumar M. , Hemachandra Reddy K., Ramachandra Reddy G., Venkata Mohana Reddy Y., Subbarami Reddy N., Nano Sci Nano Tech 4(2) (2010) (in press).

Ashok Kumar M., Hemachandra Reddy K., Venkata Mohana Reddy Y., Ramachandra Reddy G., Venkatesh Kumar N. S., Nanjunda Reddy B. H., J Metal Mater Sci 52(4) (2010) 305-315.

Ashok Kumar M., Ramachandra Reddy G., Harinatha Reddy G., Hemachandra Reddy K., Venkata Mohana Reddy Y., International Annual Symposium on Advanced Polymeric Materials (APM), CIPET, Chennai, India, March 25-27, 2011 Organized by Advanced research School for technology and product Simulation (ARSTPS). ( Received 29 January 2014; accepted 04 February 2014 ).

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