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International Letters of Chemistry, Physics and Astronomy
Volume 13
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Manufacturing of Solvent-Free Acrylic Pressure-Sensitive Adhesives in Form of Self-Adhesive Layers
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Manufacturing of Solvent-Free Acrylic Pressure-Sensitive Adhesives in Form of Self-Adhesive Layers

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Abstract:

The present publication is related to a process for producing the non-solvent acrylic pressure-sensitive adhesive (PSA). New applications and technical specifications stimulate the continuous development of new methods of polymerization of solvent-free acrylate. New synthesis of solvent-free acrylics includes polymerization in the reactor with removal of the solvent and polymerization of the carrier. The polymerization process is connected with UV-crosslinking.

Info:

Periodical:
International Letters of Chemistry, Physics and Astronomy (Volume 13)
Pages:
147-159
DOI:
https://doi.org/10.18052/www.scipress.com/ILCPA.13.147
Citation:
Z. Czech et al., "Manufacturing of Solvent-Free Acrylic Pressure-Sensitive Adhesives in Form of Self-Adhesive Layers", International Letters of Chemistry, Physics and Astronomy, Vol. 13, pp. 147-159, 2013
Online since:
May 2013
Authors:
Zbigniew Czech, Dominika Sowa, Paulina Ragańska
Keywords:
Acrylics, Polymerisation, Pressure-Sensitive Adhesives (PSA), Solvent-Free, UV-Crosslinking
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Distribution:
Open Access

Creative Commons License
This work is licensed under a
Creative Commons Attribution 4.0 International License

References:

[1] I. Benedeck, L. J. Heymans., Pressure-sensitive adhesives technology, New York: Marcel Deckker Inc., (1997).

[2] Z. Czech, Crosslinking of acrylic pressure-sensitive adhesives, Szczecin: Politechnika Szczecinska, (1999).

[3] R. Milker Z. Czech, A. Butwin, U. Głuch, E. Madejska, Coating 3 (2010) 26-28.

[4] M. Dupont, C. Mayenez, Adhäsion 3 (1989) 22-27.

[5] K. H. Schumacher, U. Düsterwald, B. Mayer-Roscher, 23. Münchener Klebstoff- und Veredelungsseminar, München, Oktober (1998) 112-117.

[6] Z. Czech, A. Kowalczyk, J. Kabatc, J. Świderska, European Polymer Journal 48 (2012) 1446-1454.

[7] Z. Czech, A. Kowalczyk, K. Górka, U. Głuch, L. Shao, Polish Journal of Chemical Technology 14(3) (2012) 83-87.

[8] Z. Czech, F. Herrmann, Patent DE 42 11 448 (1992) Lohmann GmbH & Co. KG.

[9] Z. Czech, Patent DE 195 01 025 (1995) Lohmann GmbH & Co. KG.

[10] Z. Czech, W. Blum, Patent DE 44 06 977 (1994) Lohmann GmbH & Co. KG.

[11] N. Matsuoka, H. Matsumoto, Patent DE 33 05 727 (1983) Nitto Eletric Industrial.

[12] S. Plamthottam, E. W. McFeaters, US Patent 5,100,728 (1990) Avery Dennison Corporation.

[13] Z. Czech, Kautschuk Gummi Kunststoffe 10 (2002) 492-501.

[14] Zbigniew Czech, Agnieszka Kowalczyk, Dominika Sowa, International Letters of Chemistry, Physics and Astronomy 1 (2013) 63-69.

[15] Zbigniew Czech, Dominika Sowa, Jagoda Kowalska, International Letters of Chemistry, Physics and Astronomy 3 (2013) 21-28.

[16] Zbigniew Czech, Agnieszka Kowalczyk, Dominika Sowa, Jagoda Kowalska, Paulina Ragańska, International Letters of Chemistry, Physics and Astronomy 8(1) (2013) 49-56.

[17] Zbigniew Czech, Dominika Sowa, Jagoda Kowalska, Paulina Ragańska, International Letters of Chemistry, Physics and Astronomy 8(1) (2013) 57-65.

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Cited By:

[1] A. Antosik, Z. Czech, Advanced Materials Interfaces, p. 249, 2016

DOI: https://doi.org/10.1002/9781119242604.ch7