Paper Titles in Periodical
International Letters of Chemistry, Physics and Astronomy
Volume 13
Subscribe

Subscribe to our Newsletter and get informed about new publication regulary and special discounts for subscribers!

ILCPA > Volume 13 > Manufacturing of Solvent-Free Acrylic...
Manufacturing of Solvent-Free Acrylic Pressure-Sensitive Adhesives in Form of Self-Adhesive Layers
< Back to Volume

Manufacturing of Solvent-Free Acrylic Pressure-Sensitive Adhesives in Form of Self-Adhesive Layers

Removed due to plagiarism

Full Text PDF

Abstract:

The present publication is related to a process for producing the non-solvent acrylic pressure-sensitive adhesive (PSA). New applications and technical specifications stimulate the continuous development of new methods of polymerization of solvent-free acrylate. New synthesis of solvent-free acrylics includes polymerization in the reactor with removal of the solvent and polymerization of the carrier. The polymerization process is connected with UV-crosslinking.

Info:

Periodical:
International Letters of Chemistry, Physics and Astronomy (Volume 13)
Pages:
147-159
DOI:
https://doi.org/10.18052/www.scipress.com/ILCPA.13.147
Citation:
Z. Czech et al., "Manufacturing of Solvent-Free Acrylic Pressure-Sensitive Adhesives in Form of Self-Adhesive Layers", International Letters of Chemistry, Physics and Astronomy, Vol. 13, pp. 147-159, 2013
Online since:
May 2013
Authors:
Zbigniew Czech, Dominika Sowa, Paulina Ragańska
Keywords:
Acrylics, Polymerisation, Pressure-Sensitive Adhesives (PSA), Solvent-Free, UV-Crosslinking
Export:
RIS, BibTeX, Text
Distribution:
Open Access

Creative Commons License
This work is licensed under a
Creative Commons Attribution 4.0 International License

References:

[1] I. Benedeck, L. J. Heymans., Pressure-sensitive adhesives technology, New York: Marcel Deckker Inc., (1997).

[2] Z. Czech, Crosslinking of acrylic pressure-sensitive adhesives, Szczecin: Politechnika Szczecinska, (1999).

[3] R. Milker Z. Czech, A. Butwin, U. Głuch, E. Madejska, Coating 3 (2010) 26-28.

[4] M. Dupont, C. Mayenez, Adhäsion 3 (1989) 22-27.

[5] K. H. Schumacher, U. Düsterwald, B. Mayer-Roscher, 23. Münchener Klebstoff- und Veredelungsseminar, München, Oktober (1998) 112-117.

[6] Z. Czech, A. Kowalczyk, J. Kabatc, J. Świderska, European Polymer Journal 48 (2012) 1446-1454.

[7] Z. Czech, A. Kowalczyk, K. Górka, U. Głuch, L. Shao, Polish Journal of Chemical Technology 14(3) (2012) 83-87.

[8] Z. Czech, F. Herrmann, Patent DE 42 11 448 (1992) Lohmann GmbH & Co. KG.

[9] Z. Czech, Patent DE 195 01 025 (1995) Lohmann GmbH & Co. KG.

[10] Z. Czech, W. Blum, Patent DE 44 06 977 (1994) Lohmann GmbH & Co. KG.

[11] N. Matsuoka, H. Matsumoto, Patent DE 33 05 727 (1983) Nitto Eletric Industrial.

[12] S. Plamthottam, E. W. McFeaters, US Patent 5,100,728 (1990) Avery Dennison Corporation.

[13] Z. Czech, Kautschuk Gummi Kunststoffe 10 (2002) 492-501.

[14] Zbigniew Czech, Agnieszka Kowalczyk, Dominika Sowa, International Letters of Chemistry, Physics and Astronomy 1 (2013) 63-69.

DOI: https://doi.org/10.18052/www.scipress.com/ilcpa.6.63

[15] Zbigniew Czech, Dominika Sowa, Jagoda Kowalska, International Letters of Chemistry, Physics and Astronomy 3 (2013) 21-28.

DOI: https://doi.org/10.18052/www.scipress.com/ilcpa.8.21

[16] Zbigniew Czech, Agnieszka Kowalczyk, Dominika Sowa, Jagoda Kowalska, Paulina Ragańska, International Letters of Chemistry, Physics and Astronomy 8(1) (2013) 49-56.

DOI: https://doi.org/10.18052/www.scipress.com/ilcpa.13.49

[17] Zbigniew Czech, Dominika Sowa, Jagoda Kowalska, Paulina Ragańska, International Letters of Chemistry, Physics and Astronomy 8(1) (2013) 57-65.

DOI: https://doi.org/10.18052/www.scipress.com/ilcpa.13.49
Show More Hide
Cited By:

[1] A. Antosik, Z. Czech, Advanced Materials Interfaces, p. 249, 2016

DOI: https://doi.org/10.1002/9781119242604.ch7