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Advances in Abrasive Technology XI

Key Engineering Materials Volumes 389 - 390

• Papers
• Abstracts

• p1 Prediction of Grinding Force Distribution in Wheel and Workpiece Contact Zone   [ 296 K ]
  Authors: Z. Shi, Madhusudhan Srinivasaraghavan, Helmi Attia
• p7 Study on the Subsurface Damage of Single Crystal MgO Substrates   [ 1 M ]
  Authors: Zhi Gang Dong, Ren Ke Kang, Zhen Yuan Jia
• p13 Study on Improvement of Material Removal Rate in Chemo-Mechanical Grinding (CMG) of Si Wafer   [ 239 K ]
  Authors: J. Sasaki, T. Tsuruga, B.H. Soltani, T. Mitsuta, Y.B. Tian, Jun Shimizu, Li Bo Zhou, Hiroshi Eda, Y. Tashiro, Hisao Iwase, Sumio Kamiya
• p18 Comparative Study on the Materials Removal Mechanism of Ceramics and Steels   [ 3 M ]
  Authors: Jian Qiang Guo, Hitoshi Ohmori, Kazutoshi Katahira, Yoshihiro Uehara
• p24 Grinding of Carbon/Epoxy Composites Using Electroplated CBN Wheel with Controlled Abrasive Clusters   [ 345 K ]
  Authors: H.P. Yuan, Hang Gao, Yong Jie Bao, Yong Bo Wu
• p30 Experimental Analysis of Elastic and Plastic Behavior in Ductile-Regime Machining of Glass Quartz Utilizing a Diamond Tool   [ 569 K ]
  Authors: Junichi Tamaki, Akihiko Kubo, Ji Wang Yan
• p36 Characteristics of the Wheel Surface Topography in Ultra-precision Grinding of Silicon Wafers   [ 416 K ]
  Authors: Feng Wei Huo, Dong Ming Guo, Ren Ke Kang, Zhu Ji Jin
• p42 Fractal Analysis of Self-Sharpening Phenomenon in cBN Grinding   [ 795 K ]
  Authors: Yoshio Ichida, Ryunosuke Sato, Masakazu Fujimoto, Nabil Ben Fredj
• p48 Observation of Abrasive Grains Behavior in Contact Area of Grinding Wheel and Comparison with Grinding Wheel Model   [ 3 M ]
  Authors: Taisei Yamada, Hwa Soo Lee
• p55 Thermal Damage of Micro Diameter Hole Drilled by Super-High-Speed Spindle in PWB   [ 221 K ]
  Authors: Hiroshi Nojiri, Toshiki Hirogaki, Eiichi Aoyama, Keiji Ogawa, Tsuyoshi Otsuka